Lenovo / ThinkPad / X Series
ThinkPad X13s Gen 1
ThinkPad X13s Gen 1 is a 13.3-inch notebook in the X Series family.
- Scope
- Product generation / platformPSREF verified
- Machine Type
- 21BX / 21BY
- Model / MTM
- 871Official Models verifiedDirect specifications: 21BX0000JP
Buying and service essentials
Verified in official sourcesCheck before buying
- Model / MTM
- 1 exact specifications recorded871 Models entries verified
- CPU / GPU
- Qualcomm Snapdragon Processor1 CPU options / Qualcomm Adreno 690 GPU / Platform options / integrated GPU only
- Display
- 13.3-inch / 1920x12003 platform options / Non-touch / Multi-touch
- WWAN
- Configuration-dependentRetrofit conditions apply
Upgrades and repair
- Memory
- LPDDR4x-4266 / SolderedSO-DIMM: 0 / maximum 32 GB
- Storage
- M.2 2242 SSDPCIe NVMe 4.0 x4 / Maximum simultaneous devices 1 device(s)
- Power
- USB-C Power Delivery 3.0AC adapter: 45 W / 65 W
- Parts / service
- Not collectedNot collected / Not collected
Motherboard and slot topology
?
Shows the strength of the supporting evidence. It is not a performance score or recommendation. Full sources appear in the Evidence section below.
- Memory implementation
- LPDDR4x-4266 / Soldered / SO-DIMM: 0
- Storage form factor
- M.2 2242 SSD
- Maximum simultaneous devices
- 1 device(s)
Specifications
CPU
CPU options for this platform / QualcommQualcomm Snapdragon Processor
| CPU | Integrated GPU | Cores / threads | Base frequency | Max frequency |
|---|---|---|---|---|
| Qualcomm Snapdragon 8cx Gen 3Open external site in a new tab | Qualcomm Adreno 690 GPU | Not recorded | Not recorded | Not recorded |
NPU
| NPU | Applicable CPU | NPU performance | Overall platform performance |
|---|---|---|---|
| QualcommQualcomm Hexagon NPU | Qualcomm Snapdragon 8cx Gen 3 | Not recorded | Not recorded |
These are PSREF platform options, not the NPU installed in an individual Model / MTM. Overall platform performance is distinct from NPU-only performance.
Memory
- Type
- LPDDR4x-4266
- Maximum capacity
- 32 GB
- Physical slots
- 0
- Implementation
- LPDDR4x-4266 / Soldered
- Upgrade / replacement
- Not recorded
- Capacity options
- 8 GB / 16 GB / 32 GB
- Configuration constraints
- Memory soldered to systemboard, no slots, dual-channel
Storage
- Interface and form factor
- PCIe NVMe 4.0 x4
- Supported form factors
- M.2 2242 SSD
- Physical slots
- 1
- Maximum simultaneous devices
- 1 device(s)
- Upgrade / replacement
- Not recorded
- Configuration constraints / exclusions
- One drive, up to 1TB M.2 2242 SSD
- One M.2 2242 PCIe 3.0 x4 slot
- PCIe 4.0x4 is downgraded to closer to PCIe 3.0x4 due to the system slot limitation.
Display
- Size
- 13.3-inch
- Platform configuration options
configuration Resolution Touch Panel / brightness Surface / features WUXGA IPS
13.3-inch1920x1200 Non-touch IPS / 300 nits anti-glare WUXGA IPS touch
13.3-inch1920x1200 Multi-touch IPS / 300 nits anti-glare WUXGA IPS low power
13.3-inch1920x1200 Non-touch IPS / 400 nits anti-glare / Low power / Eyesafe Certified
Battery architecture
- Architecture
- Internal
- Explicit count
- 1
| Placement | Position | Optional | Chemistry | Cell options | Capacity options |
|---|---|---|---|---|---|
| Internal | Not recorded | Not recorded | Li-Polymer | Not recorded | 49.5 Wh |
Each row is a platform configuration option. Simultaneous installation is not inferred.
Power and AC adapter
- Connector
- USB-C Power Delivery 3.0
- Wattage
- 45 W / 65 W
Wireless and WWAN
- WLAN options
- Qualcomm Wi-Fi 6E WCN6855, 802.11ax Dual Band 2x2 Wi-Fi + Bluetooth 5.1 (Bluetooth 5.2 hardware ready)
- WWAN
- Configuration-dependent
- Retrofit / conditions
- Retrofit conditions apply
- WWAN options
- Qualcomm Snapdragon X55 5G Modem-RF System, Sub-6 GHz & mmWave, M.2 card, with embedded eSIM functionality
- Qualcomm Snapdragon X55 5G Modem-RF System, Sub-6 GHz, M.2 card, with embedded eSIM functionality
- No support
- Notes
- WWAN conditions are limited to the platform options explicitly listed by PSREF.
Ports and docking
- Ports
- 1x Headphone / microphone combo jack (3.5mm)
- 2x USB-C 3.2 Gen 2 (support data transfer, Power Delivery 3.0 and DisplayPort 1.4a)
- 1x Nano-SIM card slot (WWAN support models)
- Docking support
- Various docking solutions supported via USB-C.
Dimensions and weight
- All models
- 298.7 × 206.4 × 13.4 mm
- All models
- 1.06 kg / Starting weight
Official maintenance documentation and key procedures
Not collected
Part number information
Part numbers and their relationships to this product or model are shown when verified in official Lenovo sources.
Official Model-listed parts
Not collectedKATABAN.FYI has not yet collected official Model-listed parts for this product. This is not evidence that no compatible parts exist.
Model / MTM
871Codes listed in Lenovo Models identify a relationship to this product. They do not establish exact CPU, memory, storage or other configuration details.
- Model / MTM codes verified in official sources
- 871
- Exact configuration data
- 1
Enter a code to search the official Lenovo Models data for this product.
Model / MTM with recorded exact specifications
Exact specifications recordedThese are sold configurations listed in Lenovo Models. They are not serial-number or as-built configurations. Each value comes directly from the applicable Model / MTM row.
| Model / MTM | Machine Type | Region / Country/Region | Processor | Graphics | Memory | Storage | Display | Touchscreen | WLAN / Bluetooth | WWAN | OS | Official evidence |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
21BX0000JP | 21BX | JAPAN / Japan | Qualcomm Snapdragon 8cx Gen 3 (8C, 4x Kryo Prime + 4x Kryo Gold @3.0GHz) | Integrated Qualcomm Adreno 690 GPU | 8GB Soldered LPDDR4x-4266 | 256GB SSD M.2 2242 PCIe 4.0x4 NVMe Opal 2.0 | 13.3" WUXGA (1920x1200) IPS 300nits Anti-glare, 100% sRGB | None | Qualcomm Wi-Fi 6E WCN6855, 802.11ax 2x2 + BT5.1 | Non-WWAN | Windows 11 Pro (on ARM), Japanese | Lenovo Models |
Evidence
2 sources. Of 13 product claims, 13 are verified with high confidence.This page covers PSREF platform information and identifiers listed in Lenovo Models. Exact MTM specifications and parts relationships have not been collected. Procedure coverage in official maintenance documentation is audited per product for major components.